ImageMaster^® PRO 5 Wafer

Description

The Image Master^® PRO 5 Wafer has been designed to meet the requirements of the quality assurance within the production of the new generation of objective lenses i.e. for mobile phone / digital cameras or automotive sensors that are fabricated in large quantities on wafers. Wafers of any size up to a diameter of 8‘‘ and thousands of miniature lenses or objectives can be tested and qualified in one fully automatic test run at high speed.

The brand new instrument is fully automated and prepared for measurement of lenses on circular 6-inch and 8-inch wafers or single lenses that are arranged in a tray. An additional alignment tool which determines the wafer position allows for easy and accurate loading of the instrument while an ultra-precision distance sensor measures accurately the bending of the wafer.

All the advantages and features of ImageMaster^® Pro 5 can be found in the wafer testing instrument. In addition wafer specific functions have been added:

• Ultra-accurate FFL measurement
• MTF-measurement in fixed image field planes
• Wafer bow measurement
• Faster measurement time (less 1 sec. per lens)
• Quick, software controlled wafer alignment
• Data processing for next production steps
• Clean room compatibility
• Operation status light indicator
• Easy loading due to kinematic mount and wafer rotation adjustment tool
• An assortment of pass and fail criteria allows for using the most suitable criterion for each type of lens

Wafer loading and alignment tools

Due to an easy to use wafer loading and alignment tool high precision alignment of each new wafer before measurement is not needed. After inserting a wafer into the wafer holder the instrument determines the rotation as well as the lateral offset of the lens pattern with respect to the corresponding tray file by comparing alignment marks on the wafer. Thus, the position of each lens on the wafer can be determined and used during the series measurements.

Since wafers usually show bending caused by gravity (single wafers) or internal stress from the joining process (wafer stacks) a tracking mechanism ensures that the MTF is always measured in the same plane relatively to the wafer surface for every single lens.

ImageMaster^® PRO 5 Wafer

ImageMaster^® PRO 5Wafer measurement chamber